Structure

The master structure for the 2017-18 course is:

Description of the studies

  • 12 ECTS of common Subjects.
  • 18 ECTS of a specialized module to be selected among:
    • Research module on Power Electronics.
    • Research module on Embedded Systems.
    • Professional module.
  • 6 ECTS of “Practice on Companies” (for the professional module) or “Initiation for Research” for the research modules.
  • 12 ECTS of Free Election subjects among those available in the master.
  • 12 ECTS for the Master Thesis.

Subjects of the master

  • Common subjects
  • Energy Management in Electronic Systems (3 ECTS)
  • Electronic Lab (6 ECTS)
  • Specialized Seminar 1 (1,5 ECTS)
  • Specialized Seminar 2 (1,5 ECTS)
  • Research module on POWER ELECTRONICS
  • Advanced Power Supply Systems (3 ECTS)
  • Design of Magnetic Components (3 ECTS)
  • Grid Connected Converters: AC/DC & DC/AC (3 ECTS)
  • Modelling and Control of Power Converters (3 ECTS)
  • Smart Grids (3 ECTS)
  • Three Phase Rectifiers and Inverters (3 ECTS)
  • Research module on EMBEDDED SYSTEMS
  • Wireless Sensor Networks (3 ECTS)
  • DSP: Methods and Algorithms (3 ECTS)
  • Design of Embedded Systems (3 ECTS)
  • Embedded Processing Architectures (3 ECTS)
  • High Level Description of Systems (3 ECTS)
  • Integrated Circuits and Reconfigurable Computing (3 ECTS)
  • Professional module
  • Wireless Sensor Networks (3 ECTS)
  • Compatibilidad Electromagnética (Spanish) (3 ECTS)
  • Communication Networks (3 ECTS)
  • Design of Embedded Systems (3 ECTS)
  • Intrumentación Electrónica (Spanish) (3 ECTS)
  • Electronic Design for Reliability (3 ECTS)
  • Free Election. 12 ECTS should be selected among the following subjects except those included in the selected module:
  • Advanced Power Supply Systems (3 ECTS)
  • Design of Magnetic Components (3 ECTS)
  • Grid Connected Converters: AC/DC & DC/AC (3 ECTS)
  • Modelling and Control of Power Converters (3 ECTS)
  • Smart Grids (3 ECTS)
  • Three Phase Rectifiers and Inverters (3 ECTS)
  • Wireless Sensor Networks (3 ECTS)
  • DSP: Methods and Algorithms (3 ECTS)
  • Design of Embedded Systems (3 ECTS)
  • Embedded Processing Architectures (3 ECTS)
  • High Level Description of Systems (3 ECTS)
  • Integrated Circuits and Reconfigurable Computing (3 ECTS)
  • Compatibilidad Electromagnética (Spanish) (3 ECTS)
  • Communication Networks (3 ECTS)
  • Intrumentación Electrónica (Spanish) (3 ECTS)
  • Electronic Design for Reliability (3 ECTS)
  • Analog & Power Electronics (3 ECTS)
  • Digital Electronics & Microprocessors (3 ECTS)

Clarification note: this master proposal is pending approval by the competent bodies. In case of not being tested in time, the structure of the master would be identical to the one of the course 2016-17.